Intel® Core™ Ultra 9 Processor 285K

In stock

62,000.00 Inc. Tax

Key Highlights for Enthusiasts

  • Thermal Velocity Boost (TVB): Like previous i9s, this chip can push to its 5.7 GHz limit automatically if thermal headroom and power budget allow.

  • Improved Efficiency: While the peak power (250W) remains high, the 285K is designed to deliver substantially better performance-per-watt than the i9-14900K, often running much cooler in gaming and productivity workloads.

  • Lion Cove & Skymont: It utilizes the new “Lion Cove” P-core and “Skymont” E-core architectures, which provide a significant IPC (Instructions Per Clock) uplift over the previous generation.

  • No Hyper-Threading: By removing virtual threads, Intel reduced the silicon footprint and power leakage, relying on the sheer strength of the physical cores and improved task scheduling via Intel® Thread Directo

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Product details

The Intel® Core™ Ultra 9 Processor 285K is the flagship of the “Arrow Lake-S” (Core Ultra Series 2) desktop lineup. Released in October 2024, it marks a major architectural pivot for Intel, focusing on significantly improved power efficiency and native AI integration while moving to the new LGA1851 socket.

Notably, this generation marks the end of Hyper-Threading for Intel’s desktop flagships, with every thread now mapped to a physical core.

Core & Clock Speed Specs

FeatureSpecification
Total Cores24 (8 Performance-cores + 16 Efficient-cores)
Total Threads24 (Hyper-Threading is not supported)
Max Turbo Frequency5.70 GHz (via Intel® Thermal Velocity Boost)
Intel® Turbo Boost Max 3.05.60 GHz
P-core Base Frequency3.70 GHz
E-core Base Frequency3.20 GHz
Intel® Smart Cache (L3)36 MB
Total L2 Cache40 MB

AI & Graphics

  • NPU (Neural Processing Unit): Intel® AI Boost (13 TOPS)

  • Total AI Performance: Up to 36 TOPS (Combined CPU, GPU, and NPU)

  • Integrated Graphics: Intel® Graphics (4 Xe-cores)

  • Graphics Max Dynamic Frequency: 2.00 GHz

Power & Thermal

  • Processor Base Power (TDP): 125 W

  • Maximum Turbo Power (MTP): 250 W

  • Max Operating Temperature (Tjunction): 105°C

  • Lithography: TSMC N3B (Compute Tile)

Memory & Connectivity

  • Max Memory Size: 192 GB

  • Memory Support: DDR5-6400 MT/s (Native)

  • PCI Express Revision: 5.0 and 4.0

  • Max PCI Express Lanes: 24 total (20 CPU lanes + 4 secondary)

  • Socket: FCLGA1851 (Requires 800-series motherboards, such as Z890)

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